









🔧 Elevate your repair game with precision and ease!
The Adjustable BGA Reballing Station Kit HT-90 features a lightweight aluminum alloy frame designed for durability and corrosion resistance. It supports BGA chip sizes from 9mm to 43mm with an adjustable diagonal ball planting fixture. Equipped with a drainage channel for efficient excess solder removal, this kit is perfect for professional laptop CPU and mobile phone reballing tasks.






| Manufacturer | Walfront |
| Part Number | Walfronthfrbemdv2w |
| Item Weight | 1.76 ounces |
| Finish | Finish |
| Material | Aluminum alloy |
| Power Source | PowerSource |
| Installation Method | InstallationMethod |
| Item Package Quantity | 1 |
| Spout Height | 1 Centimeters |
| Included Components | inc |
| Batteries Included? | No |
| Batteries Required? | No |
Trustpilot
3 weeks ago
1 day ago