Dow Corning 340 Silicone Heat Sink Compound 5oz 142g White Silicone Thermal Coupling Heat Conductive Grease for Electrical Devices PCB Assemblies Computer CPU Heat Sink Non Flowing

Description

Dow Corning DOWSIL 340 Heat Sink Compound White is a one component, grease like silicone that is used for thermal coupling of electrical components to heat sinks. It is non-flowing, non-curing, thermally conductive, low bleed, and has high temperature stability. 142 g Tube. White, non-flowing, highly filled compound, good thermal conductivity. Uses Designed for thermal coupling of electrical devices and PCB assemblies to heat sinks Benefits Thermally conductive compound 1 part Non flowing No need for ovens or curing Increases reliability with heat flow away from circuitry components Dow Corning 340 Thermal Compound is a grease-like silicone material with a high amount of thermally conductive metal oxide fillers. This compound has high thermal conductivity, low oil bleed and good high temperature stability. The compound can maintain consistency up to about 177°C. Therefore, it helps to maintain a reliable heat sink seal, which will improve the heat transfer from the electrical/electronic components to the heat sink or chassis. Dow Corning 340 Thermal Compound is used for bases and mounting bolts of transistors, diodes and thyristor rectifiers. It can also be used for effective thermal connection of many heat sinks that require effective cooling. Typical Use:Compound provides thermal coupling of electrical/electronic devices to heat sinks, can be applied to the base and mounting studs of transistors, diodes and silicon-controlled rectifiers. Brand:Dow Corning Color:White Components:1 part Dielectric Strength:210 V/mil Flash Point:>101.1 °C Specific Gravity: 2.1 Thermal Conductivity:0.67 W/mK Viscosity:542,000 Volume Resistivity:2 x 10^15 ohm-cm Review: Works great. Review: Easy to use and spread over desired electronics.