Often times, the pads on the PCB and BGA may be contaminated or traces of oxidation may be present even after cleaning and reballing. The reliability of a reballed BGA will be suspect if the pads on both PCB and BGA are not perfectly clean of oxidation and other contaminants. This is exactly why we think our new flux will improve the reballing process by removing any traces of contamination and oxidation to improve the chances of a reliable repair. Our flux also has a high thermal transfer coefficient to help distribute the heat under the package as evenly as possible. By distributing the heat evenly, the overall process temperature will be effectively lower. This is due to the entire area under the targetted device will be more or less at the same temperature, causing all the solder balls go into their liquidus state rather than some melting a lot earlier than others and hence delaying the lifting process. We think you will be impressed with our flux and at the same time improve the reliability of your reballed equipment.
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