Jammas Ultra Thin BGA Stencil For iPhone 5/5S/6/7/7Plus/8/8P/X/XS/XR/MAX Reball IC Tin Plant Heat Net Solder 0.08mm Thickness - (Weight: 2 PCS, Color: For iPhone 6 6P)

Descripción

Color:2 PCS / For iPhone 6 6P Descriptions: Ultra Thin BGA Stencil For iPhone 5/5S/6/7/7Plus/8/8P/X/XS/XR/MAX Reball IC Tin Plant Heat Net Solder 0.08mm Thickness Toughness Anti Drum-up Not Easily Deformed Strong MagneticFunction: Reballing IC PinsProduct Image:Delivery Time: Standard Shipping (Post): 10-25 daysDHL:3-5daysFEDEX:4-6daysUPS:3-5daysEMS:7-10daysPackage includes: All the items are new,we pack each item with plastic sealable bag that wrapped with bubble bag,and put in the hard box to ensure the safety of goods during the Item specifics:Model number: Particle size: 5-15μm